As telecoms and networking move towards greater levels of integration, new standards are emerging to improve modularity and efficiency, particularly with the Advanced Telecom Computing Architecture (ATCA) and MicroTCA standards.
Both specify various electromechanical aspects of implementing carrier grade equipment in different form factors across a multi vendor environment. Whilst the standards are evolving to improve implementation aspects and keep pace with technology, popularity is increasing because of the potential cost savings, increased functionality and multi vendor compatibility, while reduced development time speeds time to market.
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